SLIM PCI LOW PROFILE

SLIM PCI (LOW PROFILE)CARD EDGE EDEG Pitch:1.27

120PIN & 184PIN

Products summary

MATERIALS

INSULATOR:GLASS-REINFORCED HERMOPLASTIC.

                      UL94-0 RATED

CONTACT:COPPER ALLOY

PLATING:MATING AREA - SELECTED GOLD OVER

                NICKEL.SOLDER AREA-TIN OVER NICKEL.

 

ELECTRICAL

VOLTAGE RATING: 250 VAC RMS

CURRENT RATING: 1.0 AMP

INSULATION RESISTANCE: 1000 MEGOHMS MIN

CONTACT RESISTANCE: 30 MILLIOHMS MAX

 

MECHANICAL

CONTACT RETENTION: 460 GRAMS MIN PER CONTACT

INSETION FORCE: 230 GRAMS MAX PER CONTACT

                                 PAIRWTHDRAWAL FORCE: 15

                                GRAMS MIN PER CONTACT PAIR

 

ENVIRONMENTAL

TEMPERATURE RANGE:-55º TO +85º

L/T:4~5Week

P/N:R-SIZ-XXX-XXX-XXX

廣 鎰 電 子 有 限 司

Contact Us

地址:新北市三峽區介壽里光明路75巷22-1號

ADD:1F, No. 22-1, Lane75, Guang Ming Rd., Sansia Dist, New Taipei City 237, Taiwan

電話(TEL): 886-2-2674-5663

傳真(FAX): 886-2-2674-8697

電子郵件(Mail): sales@kyect.com.tw

Kung Yi Eletronic Co., Ltd

| HOME | SO DDR 200P  |SO DDR 204P  | PCI |  PCI-E | DDR | RJ | SLOT | PIN HEADER | IC SOCKET | SMART CARD | CABLE(1) | CABLE(2) | CABLE(3) | POWER CABLE |ADAPTER |

Drawings

Technical Data